Semiconductor device and method for producing the same

ABSTRACT

A semiconductor device includes a semiconductor substrate; a first insulating film that is formed over the semiconductor substrate; a capacitor that is formed over the first insulating film and is formed by sequentially stacking a lower electrode, a capacitor dielectric film, and an upper electrode; a second insulating film that is formed over the capacitor and has a hole including the entire region of the upper electrode in plan view; and a conductor plug that is formed in the hole and contains tungsten.

CROSS-REFERENCE TO RELATED APPLICATION

This application is based upon and claims the benefit of priority of theprior Japanese Patent Application No. 2011-287732, filed on Dec. 28,2011, the entire contents of which are incorporated herein by reference.

FIELD

The embodiments discussed herein are related to a semiconductor deviceand a method for producing the same.

BACKGROUND

Various types of semiconductor devices such as electrically erasableprogrammable read-only memories (EEPROMs) and ferroelectric randomaccess memories (FeRAMs) are known as semiconductor devices from whichdata does not disappear even after a power supply is stopped.

Among such semiconductor devices, EEPROMs store data by storing chargein a floating gate, and are widely used in the form of a flash memory.However, when EEPROMs are irradiated with radiation, the charge in thefloating gate easily flows to the outside, and thus EEPROMs have lowradiation resistance.

On the other hand, FeRAMs store data not by utilizing stored charge butby making the direction of polarization of a ferroelectric filmcorrespond to “0” or “1”. Accordingly, FeRAMs have higher resistance toradiation than the EEPROMs do.

In the medical field, high-energy gamma rays are used for sterilizingmedical appliances. Furthermore, devices used in nuclear power plants orouter space are also exposed to radiation having high energy, such as anelectron beam or a neutron beam.

By further enhancing the radiation resistance of FeRAMs, products thatmay be used under such high-energy radiation may be provided, andfurthermore, a new market of FeRAMs may be developed.

For example, Japanese Laid-open Patent Publication No. 05-343617discloses a semiconductor memory device.

SUMMARY

According to an aspect of the invention, an apparatus includes asemiconductor device includes a semiconductor substrate; a firstinsulating film that is formed over the semiconductor substrate; acapacitor that is formed over the first insulating film and is formed bysequentially stacking a lower electrode, a capacitor dielectric film,and an upper electrode; a second insulating film that is formed over thecapacitor and has a hole including the entire region of the upperelectrode in plan view; and a conductor plug that is formed in the holeand contains tungsten.

The object and advantages of the invention will be realized and attainedby means of the elements and combinations particularly pointed out inthe claims.

It is to be understood that both the foregoing general description andthe following detailed description are exemplary and explanatory and arenot restrictive of the invention, as claimed.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 is an enlarged plan view of a silicon substrate on which asemiconductor device according to a first embodiment is to be formed;

FIGS. 2A and 2B are cross-sectional views (part 1) illustrating aprocess of producing a semiconductor device according to the firstembodiment;

FIGS. 3A and 3B are cross-sectional views (part 2) illustrating aprocess of producing a semiconductor device according to the firstembodiment;

FIGS. 4A and 4B are cross-sectional views (part 3) illustrating aprocess of producing a semiconductor device according to the firstembodiment;

FIGS. 5A and 5B are cross-sectional views (part 4) illustrating aprocess of producing a semiconductor device according to the firstembodiment;

FIGS. 6A and 6B are cross-sectional views (part 5) illustrating aprocess of producing a semiconductor device according to the firstembodiment;

FIGS. 7A and 7B are cross-sectional views (part 6) illustrating aprocess of producing a semiconductor device according to the firstembodiment;

FIG. 8 is a cross-sectional view (part 7) illustrating a process ofproducing a semiconductor device according to the first embodiment;

FIG. 9 is a cross-sectional view (part 8) illustrating a process ofproducing a semiconductor device according to the first embodiment;

FIG. 10 is a cross-sectional view (part 9) illustrating a process ofproducing a semiconductor device according to the first embodiment;

FIG. 11 is a cross-sectional view (part 10) illustrating a process ofproducing a semiconductor device according to the first embodiment;

FIG. 12 is a cross-sectional view (part 11) illustrating a process ofproducing a semiconductor device according to the first embodiment;

FIG. 13 is a cross-sectional view (part 12) illustrating a process ofproducing a semiconductor device according to the first embodiment;

FIG. 14 is a cross-sectional view (part 13) illustrating a process ofproducing a semiconductor device according to the first embodiment;

FIG. 15 is an enlarged plan view (part 1) of a cell region in a processof producing a semiconductor device according to the first embodiment;

FIG. 16 is an enlarged plan view (part 2) of the cell region in aprocess of producing a semiconductor device according to the firstembodiment;

FIG. 17 is an enlarged plan view (part 3) of the cell region in aprocess of producing a semiconductor device according to the firstembodiment;

FIG. 18 is an enlarged plan view (part 4) of the cell region in aprocess of producing a semiconductor device according to the firstembodiment;

FIG. 19 is an enlarged plan view of an area wider than the areaillustrated in FIG. 18;

FIG. 20 is an enlarged plan view of a chip region in a process ofproducing a semiconductor device according to the first embodiment;

FIG. 21 is a cross-sectional view of a semiconductor device of the firstembodiment in a direction in which a lower electrode extends;

FIGS. 22A and 22B are views each illustrating a geometric relationshipbetween a semiconductor device according to the first embodiment andgamma rays;

FIG. 23 is a cross-sectional view of a semiconductor device of the firstembodiment in a direction orthogonal to the direction in which a lowerelectrode extends;

FIG. 24 is an enlarged plan view of a semiconductor device in the casewhere a blocking body is provided in the first embodiment;

FIG. 25 is a cross-sectional view taken along line XXV-XXV in FIG. 24;

FIG. 26 is an enlarged cross-sectional view of a ferroelectric capacitorand the periphery of the ferroelectric capacitor according to acomparative example;

FIG. 27 is an enlarged cross-sectional view of a ferroelectric capacitorand the periphery of the ferroelectric capacitor according to a secondembodiment;

FIGS. 28A and 28B are cross-sectional views each illustrating apreferable position of a first conductor plug in the second embodiment;

FIGS. 29A to 29D are plan views in the case where the center of gravityof a first hole and the center of gravity of an upper electrode are madecoincide with each other in the second embodiment;

FIGS. 30A and 30B are plan views in the case where the center of gravityof a first hole and the center of gravity of an upper electrode are madecoincide with each other and the planar shape of the upper electrode andthe planar shape of the first hole are similar to each other in thesecond embodiment;

FIGS. 31A and 31B are cross-sectional views each illustrating anotherexample of the first conductor plug in the second embodiment;

FIGS. 32A and 32B are cross-sectional views (part 1) illustrating aprocess of producing a semiconductor device according to a thirdembodiment;

FIG. 33 is a cross-sectional view (part 2) illustrating a process ofproducing a semiconductor device according to the third embodiment;

FIG. 34 is a cross-sectional view (part 3) illustrating a process ofproducing a semiconductor device according to the third embodiment;

FIG. 35 is a cross-sectional view (part 4) illustrating a process ofproducing a semiconductor device according to the third embodiment;

FIG. 36 is a cross-sectional view (part 5) illustrating a process ofproducing a semiconductor device according to the third embodiment;

FIG. 37 is a cross-sectional view (part 6) illustrating a process ofproducing a semiconductor device according to the third embodiment;

FIG. 38 is a cross-sectional view (part 7) illustrating a process ofproducing a semiconductor device according to the third embodiment;

FIG. 39 is a cross-sectional view (part 8) illustrating a process ofproducing a semiconductor device according to the third embodiment;

FIG. 40 is a cross-sectional view (part 9) illustrating a process ofproducing a semiconductor device according to the third embodiment;

FIG. 41 is a cross-sectional view (part 10) illustrating a process ofproducing a semiconductor device according to the third embodiment;

FIG. 42 is a cross-sectional view (part 11) illustrating a process ofproducing a semiconductor device according to the third embodiment;

FIG. 43 is a cross-sectional view (part 12) illustrating a process ofproducing a semiconductor device according to the third embodiment;

FIG. 44 is a cross-sectional view (part 13) illustrating a process ofproducing a semiconductor device according to the third embodiment;

FIG. 45 is a cross-sectional view (part 14) illustrating a process ofproducing a semiconductor device according to the third embodiment;

FIG. 46 is a cross-sectional view (part 15) illustrating a process ofproducing a semiconductor device according to the third embodiment;

FIG. 47 is a cross-sectional view (part 16) illustrating a process ofproducing a semiconductor device according to the third embodiment;

FIG. 48 is a cross-sectional view (part 17) illustrating a process ofproducing a semiconductor device according to the third embodiment;

FIG. 49 is a cross-sectional view (part 18) illustrating a process ofproducing a semiconductor device according to the third embodiment;

FIG. 50 is a cross-sectional view (part 19) illustrating a process ofproducing a semiconductor device according to the third embodiment;

FIG. 51 is a cross-sectional view (part 20) illustrating a process ofproducing a semiconductor device according to the third embodiment;

FIG. 52 is a cross-sectional view (part 21) illustrating a process ofproducing a semiconductor device according to the third embodiment;

FIG. 53 is a cross-sectional view (part 22) illustrating a process ofproducing a semiconductor device according to the third embodiment;

FIG. 54 is a cross-sectional view (part 23) illustrating a process ofproducing a semiconductor device according to the third embodiment;

FIG. 55 is a plan view (part 1) illustrating a process of producing asemiconductor device according to the third embodiment;

FIG. 56 is a plan view (part 2) illustrating a process of producing asemiconductor device according to the third embodiment;

FIG. 57 is a cross-sectional view (part 1) illustrating a process ofproducing a semiconductor device according to a fourth embodiment;

FIG. 58 is a cross-sectional view (part 2) illustrating a process ofproducing a semiconductor device according to the fourth embodiment;

FIG. 59 is a cross-sectional view (part 3) illustrating a process ofproducing a semiconductor device according to the fourth embodiment;

FIG. 60 is a cross-sectional view (part 4) illustrating a process ofproducing a semiconductor device according to the fourth embodiment;

FIG. 61 is a cross-sectional view (part 5) illustrating a process ofproducing a semiconductor device according to the fourth embodiment;

FIG. 62 is a cross-sectional view (part 6) illustrating a process ofproducing a semiconductor device according to the fourth embodiment;

FIG. 63 is a cross-sectional view (part 7) illustrating a process ofproducing a semiconductor device according to the fourth embodiment;

FIG. 64 is a cross-sectional view (part 8) illustrating a process ofproducing a semiconductor device according to the fourth embodiment; and

FIG. 65 is a cross-sectional view (part 9) illustrating a process ofproducing a semiconductor device according to the fourth embodiment.

DESCRIPTION OF EMBODIMENTS First Embodiment

As described above, semiconductor devices that are used in the medicalfield, nuclear power plants, or outer space are exposed to high-energygamma rays. It is believed that when a semiconductor device withstandgamma rays having a very high energy of about 100 kGy, the semiconductordevice may be used in most fields in which gamma rays are used, thoughit depends on the operating conditions of the semiconductor device.

A semiconductor device having such an improved resistance to high-energyradiation will now be described together with a description of a processof producing the semiconductor device.

FIG. 1 is an enlarged plan view of a silicon substrate 1 on which asemiconductor device according to a first embodiment is to be formed.

This semiconductor device is a planar FeRAM. A chip region C, which is aunit of individual separation in dicing, is defined in the siliconsubstrate 1. A cell region I where ferroelectric capacitors of the FeRAMare to be formed is provided inside the chip region C.

A logic region IV is provided in the chip region C located outside thecell region I. In the logic region IV, a logic circuit for controllinginput data to and output data from the ferroelectric capacitors in thecell region I is to be formed.

A method for producing this semiconductor device will now be describedwith reference to cross-sectional views of the cell region I, a cellperipheral portion II, which is a peripheral portion of the cell regionI, and a chip peripheral portion III, which is a peripheral portion ofthe chip region C. The cell peripheral portion II will be described withreference to a cross-sectional view taken along line A-A, and the chipperipheral portion III will be described with reference to across-sectional view taken along line B-B.

FIGS. 2A to 14 are cross-sectional views each illustrating a process ofproducing a semiconductor device according to the first embodiment.

First, a process of forming the cross-sectional structure illustrated inFIG. 2A will be described.

First, a trench for element isolation is formed on a surface of a p-typesilicon substrate 1, and a silicon oxide film is embedded as an elementisolation insulating film 2 in the trench. This element isolationstructure is referred to as shallow trench isolation (STI). The elementisolation structure is not limited to the STI, alternatively, elementisolation may be performed by a local oxidation of silicon (LOCOS)method.

The silicon substrate 1 is an example of a semiconductor substrate, andthe conductivity type of the silicon substrate 1 may be an n-type.

Next, a p-well 3 is formed by introducing an impurity in an activeregion of the silicon substrate 1. A thermally oxidized film functioningas a gate insulating film 4 is then formed by thermally oxidizing thesurface of the active region.

Subsequently, an amorphous or polycrystalline silicon film is formedover the entire upper surface of the silicon substrate 1. The siliconfilm is patterned by photolithography to form two gate electrodes 5 onthe p-well 3.

The two gate electrodes 5 each form a part of a word line, and arearranged in parallel with a space therebetween.

Next, an n-type impurity is introduced in the p-well 3 on both sides ofthe gate electrodes 5 by ion implantation using the gate electrodes 5 asa mask to form first to third n-type extension regions 7 a to 7 c.

An insulating film is then formed on the silicon substrate 1 and thegate electrodes 5. The insulating film is etched back and left as aninsulating side wall 9 on the side faces of the gate electrodes 5. Asilicon oxide film is formed as the insulating film by a chemical vapordeposition (CVD) method, for example.

Subsequently, an n-type impurity is introduced in the p-well 3 by ionimplantation using the insulating side wall 9 and the gate electrodes 5as a mask. As a result, an n-type source/drain region is formed, on bothsides of the gate electrodes 5, as first to third n-type impuritydiffusion regions 8 a to 8 c that respectively overlap with the first tothird n-type extension regions 7 a to 7 c.

Through the above process, basic structures of a first NMOS transistorT₁ and a second NMOS transistor T₂ are formed. The first NMOS transistorT₁ includes the first and second n-type impurity diffusion regions 8 aand 8 b and one of the gate electrodes 5. The second NMOS transistor T₂includes the second and third n-type impurity diffusion regions 8 b and8 c and the other gate electrode 5.

Subsequently, a metal film such as a cobalt film is formed over theentire upper surface of the silicon substrate 1 by a sputtering method.The metal film is then heated to react with silicon to form a silicidelayer 10 on the surfaces of the gate electrodes 5 and the surfaces ofthe first to third n-type impurity diffusion regions 8 a to 8 c. Themetal film remaining on the element isolation insulating film 2 etc. isthen removed by wet etching.

Next, as illustrated in FIG. 2B, as a cover insulating film 11 thatcovers the first NMOS transistor T₁ and the second NMOS transistor T₂,for example, a silicon oxynitride (SiON) film is formed by a plasma CVDmethod so as to have a thickness of about 200 nm.

Furthermore, a first insulating film 12 is formed on the coverinsulating film 11. For example, a silicon oxide film is formed as thefirst insulating film 12 by a plasma CVD method using tetraethoxysilane(TEOS) gas so as to have a thickness of about 1 μm.

Subsequently, the upper surface of the first insulating film 12 ispolished by a chemical mechanical polishing (CMP) method to planarizethe upper surface. As a result, the thickness of the first insulatingfilm 12 becomes about 700 nm on the planarized surface of the siliconsubstrate 1.

Next, the cover insulating film 11 and the first insulating film 12 arepatterned by photolithography.

Consequently, in the cell region I, first to third contact holes 12 a to12 c each having a diameter of about 0.25 μm are formed on the first tothird n-type impurity diffusion regions 8 a to 8 c, respectively.

Openings 12 e are formed on the element isolation insulating film 2 inthe cell region I. A fourth contact hole 12 d is formed in each of thecell peripheral portion II and the chip peripheral portion III.

A width W1 of each of the openings 12 e is preferably larger than awidth of a lower electrode of a ferroelectric capacitor described below.In the first embodiment, the width W1 is about 1.7 μm.

Next, a process of forming the cross-sectional structure illustrated inFIG. 3A will be described.

First, a titanium (Ti) film having a thickness of 30 nm and a titaniumnitride (TiN) film having a thickness of 20 nm are sequentially formedas an adhesion film 13 a on the inner surfaces of the first to fourthcontact holes 12 a to 12 d and the inner surfaces of the openings 12 e.Subsequently, a tungsten film 13 b is formed on the adhesion film 13 aby a CVD method. Thus, the first to fourth contact holes 12 a to 12 dand the openings 12 e are filled with the tungsten film 13 b.

Subsequently, unwanted portions of the tungsten film 13 b and theadhesion film 13 a on the upper surface of the first insulating film 12are removed by a CMP method.

Thus, the tungsten film 13 b and the adhesion film 13 a that are left ineach of the first to third contact holes 12 a to 12 c function as firstto third contact plugs 14 a to 14 c that are electrically connected tothe n-type impurity diffusion regions 8 a to 8 c, respectively.

The tungsten film 13 b and the adhesion film 13 a that are left in eachof the openings 12 e in the cell region I function as a conductor 15.The tungsten film 13 b and the adhesion film 13 a that are left in eachof the fourth contact holes 12 d in the cell peripheral portion II andthe chip peripheral portion III function as a lower ring 16.

FIG. 15 is an enlarged plan view of the cell region I after the processof forming the cross-sectional structure illustrated in FIG. 3A iscompleted. FIG. 3A corresponds to a cross-sectional view taken alongline IIIA-IIIA in FIG. 15.

In FIG. 15, the gate electrodes 5 and the first to third contact plugs14 a to 14 c are omitted. Similarly, the gate electrodes 5 and the firstto third contact plugs 14 a to 14 c are omitted in FIGS. 16 to 18described below.

As illustrated in FIG. 15, the conductor 15 and the opening 12 e thatdefines the outline of the conductor 15 have a stripe shape in planview.

Subsequently, as illustrated in FIG. 3B, a silicon oxynitride film isformed as a first antioxidation insulating film 17 on the first to thirdcontact plugs 14 a to 14 c, the conductors 15, the lower rings 16, andthe first insulating film 12 by a plasma CVD method so as to have athickness of about 100 nm.

Silicon oxynitride contained in the first antioxidation insulating film17 has a good capability of suppressing permeation of oxygen. Thus, thefirst antioxidation insulating film 17 has a function of suppressingoxidation of the tungsten film 13 b of the conductor 15 by oxygen.

Furthermore, a silicon oxide film is formed on the first antioxidationinsulating film 17. The silicon oxide film functions as a firstinterlayer insulating film 18. The conditions for depositing the firstinterlayer insulating film 18 are not particularly limited. In the firstembodiment, the first interlayer insulating film 18 is formed so as tohave a thickness of about 130 nm by a plasma CVD method using TEOS gas.

Subsequently, an alumina film is formed as a second antioxidationinsulating film 19 on the first interlayer insulating film 18 by asputtering method. In the sputtering method, argon gas is used as asputtering gas, the pressure in the sputtering atmosphere is 1 Pa, andthe substrate temperature is 25° C. to 35° C., for example.

In order to enhance the orientation of a lower electrode of a capacitordescribed below, the second antioxidation insulating film 19 may beannealed after the deposition of the second antioxidation insulatingfilm 19. For example, this annealing is conducted in anoxygen-containing atmosphere for one minute at a substrate temperatureof 642° C.

Next, a process of forming the cross-sectional structure illustrated inFIG. 4A will be described.

First, a platinum film is formed as a first conductive film 20 on thesecond antioxidation insulating film 19 by a sputtering method so as tohave a thickness of about 100 nm.

The conditions for depositing the first conductive film 20 are notparticularly limited. In the first embodiment, the first conductive film20 is formed using argon gas as a sputtering gas, at a pressure in thesputtering atmosphere of 1 Pa, at a substrate temperature of 350° C.,and a sputtering power of 0.4 kW.

The first conductive film 20 may be a single-layer film such as aniridium film, a ruthenium film, a ruthenium oxide film, or a strontiumruthenium oxide (SRO) film. Alternatively, the first conductive film 20may be a stacked film of these films.

Subsequently, in order to improve the crystal quality of the firstconductive film 20, rapid thermal anneal (RTA) is performed in anatmosphere of an inert gas such as argon gas at a substrate temperatureof 650° C. to 750° C. for 60 seconds. This annealing may improve thecrystal quality of platinum of the first conductive film 20 and increasethe adhesion between the second antioxidation insulating film 19 and thefirst conductive film 20.

Next, a lead zirconate titanate (PZT) film is formed as a ferroelectricfilm 21 on the first conductive film 20. The PZT film is formed as twolayers of a fast and a second PZT films thruogh two step processes.

In a first step, the amorphous first PZT film is formed on the firstconductive film 20 by an RF sputtering method so as to have a thicknessof about 90 nm. The first PZT film is crystallized by being subjected toRTA in an oxygen-containing atmosphere at a substrate temperature of600° C. for 90 seconds. Such annealing for the purpose ofcrystallization is referred to as “crystallization annealing”.

A sol-gel method or a metal-organic chemical vapor deposition (MOCVD)method may also be employed as the method for forming the PZT film. Inthe case where the MOCVD method is employed, crystallization annealingmay not be performed.

Furthermore, the second PZT film is formed on the first PZT film by anRF sputtering method so as to have a thickness of about 10 to 30 nm.

Any of calcium (Ca), strontium (Sr), lanthanum (La), niobium (Nb),tantalum (Ta), iridium (Ir), and tungsten (W) may be added to each ofthe first PZT film and the second PZT film. Instead of PZT, a bismuthlayer-structured compound such as SrBi₂Ta₂θ₉, SrBi₄Ti₄θ₁₅,(Bi,La)₄Ti₃θ₁₂, or BiFeθ₃ may be used as the material of theferroelectric film 21.

Next, an iridium oxide film having a two-layer structure is formed onthe ferroelectric film 21. The iridium oxide film functions as a secondconductive film 22. Iridium oxide has a good capability of suppressinghydrogen diffusion, and thus may suppress the degradation of theferroelectric film 21 due to reduction by hydrogen in the outsideatmosphere. Thus, iridium oxide is suitable for the material of thesecond conductive film 22.

In the iridium oxide film having the two-layer structure, a firstiridium oxide film is formed so as to have a thickness of about 25 nm bya sputtering method in which an iridium target is used while using, as asputtering gas, a mixed gas containing argon gas and oxygen gas. As forthe conditions for depositing the first iridium oxide film, for example,a pressure of 2 Pa, a substrate temperature of 300° C., and a sputteringpower of 1 to 2 kW are used. In this case, the ratio of the flow rate ofargon gas to the flow rate of oxygen gas is, for example, 100:56. Underthis condition, the first iridium oxide film is crystallized at the timeof the deposition.

The first iridium oxide film formed as described above is subjected toRTA in an oxygen-containing atmosphere, thereby crystallizing PZT in theferroelectric film 21 and compensating for oxygen deficiency of the PZT.

The conditions for this RTA are not particularly limited. In the firstembodiment, the ratio of the flow rate of argon gas to the flow rate ofoxygen gas is 100:1, and the resulting mixed gas is supplied to theannealing atmosphere. This annealing is conducted at a substratetemperature of 725° C. for 60 seconds.

This annealing is also advantageous in that the first iridium oxide filmis recovered from plasma damage.

Next, a second iridium oxide film is formed on the first iridium oxidefilm by a sputtering method so as to have a thickness of 50 to 150 nm.As for the conditions for depositing the second iridium oxide film, forexample, a pressure of 0.8 Pa, a sputtering power of 1.0 kW, and adeposition time of 45 seconds may be used.

As a sputtering gas, argon gas and oxygen gas may be used at a ratio ofthe flow rate of argon gas to the flow rate of oxygen gas of 100:1.

In order to suppress abnormal growth of the second iridium oxide film,it is preferable to control the substrate temperature during depositionto 100° C. or lower.

Subsequently, PZT deposited on the reverse face of the silicon substrate1 is removed by washing.

Subsequently, as illustrated in FIG. 4B, a titanium nitride film isformed as a mask material film 23 on the second conductive film 22 by asputtering method so as to have a thickness of about 20 to 50 nm.

Next, a photoresist is applied onto the mask material film 23. Thephotoresist is then exposed and developed to form a first resist pattern24 for an upper electrode.

Next, as illustrated in FIG. 5A, portions of the mask material film 23,the portions not being covered with the first resist pattern 24, aredry-etched so that the mask material film 23 that is not etched but leftforms a hard mask 23 a.

A mixed gas of chlorine gas and argon gas is used as an etching gas inthe dry etching, and is introduced into the etching atmosphere at a flowrate of chlorine gas of 80 sccm and a flow rate of argon gas of 80 sccm.In the dry etching, the pressure in the etching atmosphere is set to 0.7Pa, and a high-frequency power with a source power of 800 W at afrequency of 13.56 MHz and a low-frequency power with a bias power of100 W at a frequency of 450 kHz are applied to the etching atmosphere.

Next, as illustrated in FIG. 5B, portions of the second conductive film22, the portions not being covered with the hard mask 23 a, aredry-etched to form upper electrodes 22 a.

The conditions for this dry etching are not particularly limited. In thefirst embodiment, the dry etching is performed using a mixed gas ofchlorine gas and argon gas as an etching gas.

In this dry etching, the first resist pattern 24 is also etched and sidefaces of the first resist pattern 24 recede, and thus side faces of thehard mask 23 a also slightly recede. Consequently, side faces of theupper electrode 22 a form a tapered shape.

Subsequently, as illustrated in FIG. 6A, the first resist pattern 24 isremoved, and the hard mask 23 a is removed by dry etching or wetetching.

Next, as illustrated in FIG. 6B, a photoresist is applied over theentire upper surface of the silicon substrate 1. The photoresist is thenexposed and developed to form a second resist pattern 25.

Next, the ferroelectric film 21 is dry-etched using the second resistpattern 25 as a mask to form a capacitor dielectric film 21 a. Anexample of an etching gas used in this dry etching is a mixed gas of Cl₂gas and BCl₂ gas.

In this dry etching, the second resist pattern 25 is also etched andside faces of the second resist pattern 25 recede, and thus side facesof the upper electrode 22 a also slightly recede. Consequently, sidefaces of the capacitor dielectric film 21 a form a tapered shape.

The second resist pattern 25 is then removed.

Subsequently, as illustrated in FIG. 7A, an alumina film is formed as afirst protective insulating film 26 on the capacitor dielectric film 21a, the upper electrodes 22 a, and the first conductive film 20 by asputtering method so as to have a thickness of about 50 nm.

Alumina, which is the material of the first protective insulating film26, has a good capability of suppressing permeation of hydrogen. Thus,the first protective insulating film 26 has a function of suppressingthe degradation of the capacitor dielectric film 21 a due to reductionby hydrogen in the outside atmosphere.

Next, as illustrated in FIG. 7B, a photoresist is applied over theentire upper surface of the silicon substrate 1. The photoresist is thenexposed and developed to form a third resist pattern 27.

Subsequently, the first conductive film 20 is dry-etched using the thirdresist pattern 27 as a mask while using a mixed gas of Cl₂ gas, BCl₃gas, and HBr gas as an etching gas to form lower electrodes 20 a.

In this dry etching, portions of the first protective insulating film26, the portions being located on side faces of the capacitor dielectricfilm 21 a and the upper electrode 22 a, are also removed, and portionsof the second antioxidation insulating film 19, the portions not beingcovered with the lower electrode 20 a, are also removed.

Furthermore, the third resist pattern 27 is also dry-etched and sidefaces of the third resist pattern 27 recede, and thus side faces of thecapacitor dielectric film 21 a also slightly recede. Consequently, sidefaces of the lower electrode 20 a form a tapered shape.

Through the above process, ferroelectric capacitors Q each formed bystacking the lower electrode 20 a, the capacitor dielectric film 21 a,and the upper electrode 22 a in that order are formed in the cell regionI of the silicon substrate 1. The third resist pattern 27 is thenremoved.

FIG. 16 is an enlarged plan view of the cell region I after the aboveprocess is completed. FIG. 7B corresponds to a cross-sectional viewtaken along line VIIB-VIIB in FIG. 16.

As illustrated in FIG. 16, each of the lower electrode 20 a and thecapacitor dielectric film 21 a has a stripe shape extending in a wordline direction D in plan view.

A plurality of upper electrodes 22 a are arranged on the capacitordielectric film 21 a at intervals. A plurality of ferroelectriccapacitors Q are formed so as to correspond to the respective upperelectrodes 22 a.

The conductor 15 and the opening 12 e that are located below each of theferroelectric capacitors Q are formed so as to have a size that includesthe entire region of the lower electrode 20 a inside thereof in planview.

Subsequently, as illustrated in FIG. 8, an alumina film is formed as asecond protective insulating film 28 on the ferroelectric capacitors Qand the first interlayer insulating film 18 by a sputtering method. Thesecond protective insulating film 28 protects the capacitor dielectricfilm 21 a from a reducing substance such as hydrogen.

The ferroelectric capacitors Q are then annealed in an oxygen-containingatmosphere so that the capacitor dielectric film 21 a recovers fromdamage sustained in the above process. This annealing is referred to as“recovery annealing”. The conditions for the recovery annealing are notparticularly limited.

In the first embodiment, the recovery annealing is conducted in afurnace (not illustrated) in an oxygen atmosphere at a substratetemperature of 550° C. to 700° C. for 60 minutes.

Next, a process of forming the cross-sectional structure illustrated inFIG. 9 will be described.

First, a silicon oxide film is formed as a second insulating film 29 onthe second protective insulating film 28 by a plasma CVD method so as tohave a thickness of about 1,400 nm. For example, a mixed gas of TEOSgas, oxygen gas, and helium gas may be used as a deposition gas in theplasma CVD method.

The surface of the second insulating film 29 is planarized by a CMPmethod, and the second insulating film 29 is then annealed in a plasmaatmosphere of nitrous oxide (N₂O) gas or nitrogen gas. Thus, the secondinsulating film 29 is dehydrated, and the surface of the secondinsulating film 29 is nitrided to suppress readsorption of moisture.

Next, an alumina film is formed on the second insulating film 29 by asputtering method so as to have a thickness of about 20 to 100 nm. Thealumina film functions as a third protective insulating film 30.Similarly to the second protective insulating film 28, the thirdprotective insulating film 30 has a function of protecting the capacitordielectric film 21 a from a reducing substance such as hydrogen. Thethird protective insulating film 30 may be formed by a CVD methodinstead of the sputtering method.

A silicon oxide film is formed as a second interlayer insulating film 31on the third protective insulating film 30 by a plasma CVD method usingTEOS gas so as to have a thickness of about 300 to 500 nm.

Subsequently, as illustrated in FIG. 10, the second protectiveinsulating film 28, the second insulating film 29, the third protectiveinsulating film 30, and the second interlayer insulating film 31 arepatterned by photolithography and dry etching to form a first hole 29 aon each of the ferroelectric capacitors Q.

An etching gas used in this dry etching is not particularly limited. Forexample, a mixed gas of C₄F₈, Ar, O₂, and CO may be used as the etchinggas.

FIG. 17 is an enlarged plan view of the cell region I after the aboveprocess is completed. FIG. 10 corresponds to a cross-sectional viewtaken along line X-X in FIG. 17.

As illustrated in FIG. 17, a plurality of first holes 29 a are formed soas to correspond to the upper electrodes 22 a. Each of the first holes29 a is formed so as to have a size that includes the entire region ofthe upper electrode 22 a inside thereof in plan view.

As described above, the side faces of the upper electrode 22 a areinclined in a tapered manner, and the upper surface of the upperelectrode 22 a is smaller than the lower surface thereof. The first hole29 a is preferably formed so as to include the entire region of thelower surface of the upper electrode 22 a. This also applies to secondto fourth embodiments described below.

In this process, a second hole 29 b is formed in the second insulatingfilm 29 on an end of the lower electrode 20 a, and the lower electrode20 a is exposed from the second hole 29 b.

Furthermore, the opening 12 e is formed so as to have a size thatincludes the entire region of the lower electrode 20 a inside thereof inplan view. Accordingly, the conductor 15 is formed so as to be largerthan the lower electrode 20 a.

Next, as illustrated in FIG. 11, annealing is performed on the secondinsulating film 29 in an oxygen-containing atmosphere at a substratetemperature of 450° C. for 60 minutes so that moisture contained in thesecond insulating film 29 is released to the outside through the firstholes 29 a. During this annealing, oxygen 201 diffuses into theferroelectric capacitors Q through the first holes 29 a.

In the first embodiment, since each of the first holes 29 a is formed soas to be larger than the corresponding upper electrode 22 a as describedabove, moisture in the second insulating film 29 is immediately releasedto the outside through the first holes 29 a and thus the effect ofdehydration by annealing may be increased.

Subsequently, as illustrated in FIG. 12, a multilayer insulating filmranging from the second interlayer insulating film 31 to the firstantioxidation insulating film 17 is patterned by photolithography anddry etching.

By this patterning, in the cell region I, third to fifth holes 29 c to29 e are respectively formed on the first to third contact plugs 14 a to14 c. In each of the cell peripheral portion II and the chip peripheralportion III, a sixth hole 29 f is formed on the lower ring 16.

An etching gas used in the above dry etching is not particularlylimited. In the first embodiment, a mixed gas of C₄F₈, Ar, O₂, and CO isused as the etching gas of the first interlayer insulating film 18, thesecond protective insulating film 28, the second insulating film 29, thethird protective insulating film 30, and the second interlayerinsulating film 31. The first antioxidation insulating film 17 isremoved by sputter etching using argon gas.

Next, a process of forming the cross-sectional structure illustrated inFIG. 13 will be described.

First, a single-layer titanium nitride film is formed as a conductiveadhesion film 32 a on the inner surfaces of the first holes 29 a and thethird to sixth holes 29 c to 29 f and the upper surface of the secondinterlayer insulating film 31 by a sputtering method so as to have athickness of about 100 to 150 nm.

As illustrated in the dotted line circle of the cell region I, theadhesion film 32 a is grown on a side face and the bottom surface of thefirst hole 29 a in different directions, and thus a growth line 32 xindicating a grain boundary due to the difference in the growthdirection is formed in the adhesion film 32 a.

Next, a tungsten film 32 b is formed on the adhesion film 32 a by a CVDmethod using hydrogen gas and tungsten hexafluoride gas as a depositiongas. Each of the first holes 29 a and the third to sixth holes 29 c to29 f is filled with the tungsten film 32 b.

The substrate temperature during the formation of the tungsten film 32 bis determined in accordance with the magnitude of a stress desired forthe tungsten film 32 b. The substrate temperature is preferably, forexample, about 350° C. to 400° C.

Hydrogen in the deposition gas has a property of diffusing in anunderlying layer through the growth line 32 x of the adhesion film 32 a.However, in the first embodiment, since the first hole 29 a is formed soas to be larger than the upper electrode 22 a, the growth line 32 x islocated on a side of the upper electrode 22 a, as illustrated in thedotted line circle.

Accordingly, it is possible to reduce the risk that iridium oxideconstituting the upper electrode 22 a is exposed to hydrogen passingthrough the growth line 32 x and to suppress a decrease in the volume ofthe upper electrode 22 a, the decrease being due to reduction of iridiumoxide by hydrogen.

If the volume of the upper electrode 22 a decreases, cracks are formedin the upper electrode 22 a, fluorine in the tungsten hexafluoride gasreaches the capacitor dielectric film 21 a through the cracks, and apore is formed in the capacitor dielectric film 21 a by an etchingaction of fluorine. In the first embodiment, the formation of such apore is suppressed, and the yield of the semiconductor device may beimproved.

Subsequently, unwanted portions of the adhesion film 32 a and thetungsten film 32 b on the upper surface of the second interlayerinsulating film 31 are removed by CMP.

The adhesion film 32 a and the tungsten film 32 b that are not polishedbut are left function as first conductor plug 33 in the first hole 29 aand third to fifth conductor plugs 34 c to 34 e in the third to fifthholes 29 c to 29 e, respectively.

Among the first conductor plug 33 and the third to fifth conductor plugs34 c to 34 e, the first conductor plug 33 is electrically connected tothe upper electrode 22 a, and the third to fifth conductor plugs 34 c to34 e are electrically connected to the first to third contact plugs 14 ato 14 c, respectively.

In each of the cell peripheral portion II and the chip peripheralportion III, an upper ring 35 is formed in the sixth hole 29 f. Theupper ring 35 and the lower ring 16 that are formed in the cellperipheral portion II form a conductor ring 37. The upper ring 35 andthe lower ring 16 that are formed in the chip peripheral portion IIIform a moisture-resistant ring 38.

FIG. 18 is an enlarged plan view of the cell region I after the processof forming the cross-sectional structure illustrated in FIG. 13 iscompleted. FIG. 13 corresponds to a cross-sectional view taken alongline XIII-XIII in FIG. 18.

As illustrated in FIG. 18, the first conductor plug 33 is formed so asto have a size that covers the entire region of the upper electrode 22 ain plan view.

In this process, a second conductor plug 34 b in which the adhesion film32 a and the tungsten film 32 b are sequentially stacked is formed inthe second hole 29 b on an end of the lower electrode 20 a.

FIG. 19 is an enlarged plan view of the cell region I in an area widerthan the area illustrated in FIG. 18.

As illustrated in FIG. 19, two stripe-shaped lower electrodes 20 a forma pair, and a plurality of the pairs of lower electrodes 20 a extend onthe silicon substrate 1.

FIG. 20 is an enlarged plan view of the chip region C after the aboveprocess is completed.

As illustrated in FIG. 20, the conductor ring 37 is formed so as to havea ring shape surrounding the cell region I in plan view, and themoisture-resistant ring 38 is formed so as to have a ring shapesurrounding the entire part of the chip region C in plan view.

By surrounding the chip region C with the moisture-resistant ring 38 inthis manner, the entry of moisture in the outside atmosphere into thechip region C from a lateral direction of the substrate may be blockedby the moisture-resistant ring 38. Thus, the degradation of thecapacitor dielectric film 21 a due to moisture nay be suppressed.

Next, as illustrated in FIG. 14, a multilayer metal film is formed overthe entire upper surface of the silicon substrate 1. The multilayermetal film is then patterned to form a first metal wiring 36 a, a firstconductive pad 36 b, and a second conductive pad 36 c.

For example, the multilayer metal film is formed by depositing atitanium film having a thickness of 60 nm, a titanium nitride filmhaving a thickness of 30 nm, a copper-containing aluminum film having athickness of 360 nm, a titanium film having a thickness of 5 nm, and atitanium nitride film having a thickness of 70 nm in that order by asputtering method.

Through the above process, a basic structure of the semiconductor deviceaccording to the first embodiment is formed.

According to the first embodiment described above, as illustrated inFIG. 14, the first conductor plug 33 and the conductor 15 that containtungsten are respectively provided above and below each ferroelectriccapacitor Q.

Tungsten has an atomic radius larger than that of aluminum or copper,which is used as a wiring material, and thus has a good capability ofblocking radiation such as gamma rays. Accordingly, tungsten may blockgamma rays γ coming toward the ferroelectric capacitor Q.

The ferroelectric capacitor Q itself also has a capability of blockingradiation to a certain degree because PZT in the capacitor dielectricfilm 21 a contains lead. The blocking capability is reinforced by theconductor 15 and the first conductor plug 33 to enhance the radiationresistance of the semiconductor device.

In particular, since the conductor 15 is formed so as to be larger thanthe lower electrode 20 a in plan view, most of the gamma rays γ comingfrom below the silicon substrate 1 to the capacitor dielectric film 21 amay be blocked by the conductor 15.

Similarly, since the first conductor plug 33 is formed so as to belarger than the upper electrode 22 a in plan view, most of the gammarays γ coming from above the silicon substrate 1 to the capacitordielectric film 21 a may be blocked by the first conductor plug 33.

According to the disclosure described above, since a hole is formed soas to include the entire region of an upper electrode in plan view, mostof the radiation coming toward a capacitor dielectric film may beblocked by a conductor plug formed in the hole. Thus, the radiationresistance of a semiconductor device is enhanced

In the first embodiment, the side faces of the upper electrode 22 a areinclined in a tapered manner, and the upper surface of the upperelectrode 22 a is smaller than the lower surface of the upper electrode22 a. In this case, the incidence of the gamma rays γ from above may beeffectively suppressed by forming the first hole 29 a so as to be largerthan the lower surface of the upper electrode 22 a in plan view andembedding the first conductor plug 33 in the first hole 29 a.

The gamma rays γ coming from a lateral direction of the substrate towardthe ferroelectric capacitor Q may be blocked by the conductor ring 37containing tungsten. In particular, by forming the conductor ring 37 soas to have a height reaching the upper surface of the second insulatingfilm 29, the capability of blocking the gamma rays γ by the conductorring 37 may be increased.

In order to enhance the radiation resistance of the semiconductor deviceregardless of the incident angle of gamma rays, the semiconductor devicepreferably has the following structure.

FIG. 21 is a cross-sectional view of the above-described semiconductordevice in a direction in which the lower electrode 20 a extends andcorresponds to a cross-sectional view taken along line XXI-XXI in FIG.18.

In this example, it is assumed that gamma rays γ are incident on thecapacitor dielectric film 21 a at an incident angle of θ₁. Note that theincident angle θ₁ is an angle formed between a normal line direction nof the silicon substrate 1 and a direction in which the gamma rays γ areincident.

The term “gamma rays γ” represents gamma rays having the maximumincident angle θ₁ among gamma rays γ that may be incident on thecapacitor dielectric film 21 a of one of the capacitors Q without beingblocked by the first conductor plug 33 of the other of the capacitors Q.

The gamma rays γ are negligibly blocked by the adhesion film 32 a of thefirst conductor plug 33. Accordingly, in FIG. 21, the gamma rays γ areillustrated as penetrating through the adhesion film 32 a.

In FIG. 21, symbol X denotes a width of a portion of the capacitordielectric film 21 a right under the upper electrode 22 a, the portionbeing irradiated with the gamma rays γ.

The capacitor dielectric film 21 a right under the upper electrode 22 acontributes to ensuring of the amount of switching charge of theferroelectric capacitor Q etc. Therefore, if the capacitor dielectricfilm 21 a right under the upper electrode 22 a is irradiated with thegamma rays γ, the amount of switching charge may be decreased.Accordingly, ideally, the width X is preferably zero.

A discussion will be made regarding a design of the semiconductor devicein which the dimensions of the semiconductor device are such that awidth X of zero is realized.

In FIG. 21, the dimensions are denoted as follows. a: distance betweenlower surfaces of adjacent upper electrodes 22 a, b: distance betweenlower surface of upper electrode 22 a and upper surface of firstconductor plug 33, c: distance between upper surfaces of adjacenttungsten films 32 b, d: distance between lower surfaces of adjacenttungsten films 32 b, e: distance between lower surface and upper surfaceof tungsten film 32 b

In FIG. 21, the dimension a is illustrated only in a portion of thesemiconductor device. However, each portion of the semiconductor deviceis regularly arranged in accordance with a design rule, and thus, in anyposition of the semiconductor device, the dimension a is the same value.This also applies to the other dimensions b to e.

FIG. 22A illustrates a right triangle whose hypotenuse represents thegamma rays γ immediately before the incidence on the capacitordielectric film 21 a. In this case, the following formula (1) isgeometrically satisfied.

tan θ₁=((a−d)2+X)/(b−e)  (1)

In deriving formula (1), it is assumed that the center of gravity of theupper electrode 22 a and the center of gravity of the first conductorplug 33 coincide with each other, and that the tungsten film 32 b of thefirst conductor plug 33 protrudes from an end of the upper electrode 22a in the lateral direction by (a−d)/2.

As described above, X is preferably zero. Accordingly, when X in formula(1) is zero, the following formula (2) is obtained.

(a−d)/2=(b−e)×tan θ₁  (2)

In order to calculate θ₁ of formula (2), a right triangle illustrated inFIG. 22B is considered. FIG. 22B illustrates a right triangle having aheight equal to the above-described distance e and a hypotenusecorresponding to the gamma rays γ.

The length of the base of this right triangle includes not only thedistance c between the upper surfaces of adjacent tungsten films 32 bbut also a value (d−c)/2. This is based on the assumption that thecenter of gravity of the upper electrode 22 a and the center of gravityof the first conductor plug 33 coincide with each other as describedabove, and that an end E₁ of the upper surface of the tungsten film 32 bprotrudes from an end E₂ of the lower surface of the tungsten film 32 bin the lateral direction of the substrate by (d−c)/2.

The following formula (3) is geometrically obtained from FIG. 22B.

tan θ₁=(c+(d−c)/2)/e=(c+d)/(2e)  (3)

By substituting formula (3) for formula (2), the following formula (4)is obtained.

(a−d)/2=(b−e)×(c+d)/(2e)=b(c+d)/(2e)−(c+d)/2  (4)

That is, in order that the capacitor dielectric film 21 a right underthe upper electrode 22 a is not exposed to the gamma rays γ, thesemiconductor device is designed so as to satisfy formula (4).

FIG. 23 is a cross-sectional view of the semiconductor device accordingto the first embodiment in a direction orthogonal to a direction inwhich the lower electrode 20 a extends and corresponds to across-sectional view taken along line XXIII-XXIII in FIG. 19.

In FIG. 23, the dimensions a to e each denote the same as those in FIG.21.

Symbol c₁ denotes the distance between the upper surface of the tungstenfilm 32 b of the fifth conductor plug 34 e and the upper surface of thetungsten film 32 b of the first conductor plug 33.

Symbol d₁ denotes the distance between the tungsten film 32 b of thefifth conductor plug 34 e and the lower surface of the tungsten film 32b of the first conductor plug 33.

When viewed from the cross section of FIG. 23, in this semiconductordevice, side faces of two ferroelectric capacitors Q face each other ina first region R1, and a side face of the fifth conductor plug 34 e anda side face of a ferroelectric capacitor Q face each other in a secondregion R2.

In order that the capacitor dielectric film 21 a right under the upperelectrode 22 a is not exposed to gamma rays γ₁ incident on the firstregion R1, formula (4) is satisfied because of the same reason as thereason that has been described with reference to FIGS. 22A and 22B.

That is, in the case where formula (4) is satisfied, the gamma rays γ₁coming toward the capacitor dielectric film 21 a right under the upperelectrode 22 a of one of adjacent ferroelectric capacitors Q may beblocked by a tungsten film 32 b on the other ferroelectric capacitor Q.

In the second region R2, the tungsten film 32 b of the fifth conductorplug 34 e blocks gamma rays γ₂, and dimensions related to the tungstenfilm 32 b are c₁ and d₁. Accordingly, in the second region R2, when thefollowing formula (5), which is obtained by respectively changing c andd in formula (4) to c₁ and d₁, is satisfied, X becomes zero and thecapacitor dielectric film 21 a right under the upper electrode 22 a isnot exposed to the gamma rays γ₂.

(a−d ₁)/2=(b−e)×(c ₁ +d ₁)/(2e)=b(c ₁ +d ₁)/(2e)−(c ₁ +d ₁)/2  (5)

In order to block gamma rays more effectively, it is effective toprovide a blocking body containing tungsten over a wide area above thefirst conductor plug 33.

FIG. 24 is an enlarged plan view of a semiconductor device according tothe first embodiment, the semiconductor device including such a blockingbody.

In this example, a plurality of blocking bodies 85 are provided abovethe third to fifth conductor plugs 34 c to 34 e at intervals. Gamma rayscoming toward a ferroelectric capacitor Q may be effectively blocked bythe blocking bodies 85, thereby suppressing a decrease in the amount ofswitching charge of the capacitor dielectric film 21 a due to the gammarays.

However, since gaps are present around the blocking bodies 85, gammarays coming from the gaps toward the ferroelectric capacitor Q arepresent.

Two types of gamma rays γ₃ and γ₄ coming toward a ferroelectriccapacitor Q through the blocking body 85 and the third to fifthconductor plugs 34 c to 34 e will now be discussed.

FIG. 25 is a cross-sectional view taken along line XXV-XXV in FIG. 24.

In FIG. 25, the dimensions a to e each denote the same as those in FIG.21.

As illustrated in FIG. 25, in this example, a third insulating film 81and82, a fourth metal wiring 83, and a fourth insulating film 84 areformed on the first metal wiring 36 a in that order.

The third insulating film 81 and the fourth insulating film 84 may eachbe a silicon oxide film formed by a CVD method. The fourth metal wiring83 may be a multilayer metal film having the same structure as the firstmetal wiring 36 a.

Furthermore, a blocking body 85 formed by stacking an adhesion film 85 aand a tungsten film 85 b in that order is provided on the fourth metalwiring 83. A fifth metal wiring 86 having the same layer structure asthe first metal wiring 36 a is formed on the blocking body 85.

In FIG. 25, symbols L1 to L3 etc. denote the following. L1: arrangementpitch of two adjacent tungsten films 85 b, L2: width of upper surface oftungsten film 85 b, L3: distance between end E₃ of upper surface oftungsten film 85 b and end E₂ of lower surface of tungsten film 32 b inlateral direction of substrate, h: distance between lower surface ofupper electrode 22 a and lower surface of tungsten film 85 b in normalline direction of substrate, hw: distance between lower surface andupper surface of tungsten film 85 b

In a semiconductor device having this cross-sectional structure, theabove-described two types of gamma rays γ₃ and γ₄ are incident on thecapacitor dielectric film 21 a.

The gamma rays γ₃ pass through an edge of, among the plurality ofblocking bodies 85, the blocking body 85 that is the closest to theferroelectric capacitor Q and are incident on the capacitor dielectricfilm 21 a at an incident angle of θ₂.

Regarding the incident angle θ₂, the following formula (6) isgeometrically satisfied.

tan θ₂=(L3−L2+(a−d)/2)/(h+hw)  (6)

In order to satisfy X=0, the following formula (7) is satisfied becauseof the same reason as the reason regarding formula (2).

(a−d)/2=(b−e)×tan θ₂  (7)

By substituting formula (6) for formula (7), the following formula (8)is obtained.

(a−d)/2=(b−e)×(L3−L2+(a−d)/2)/(h+hw)  (8)

That is, in order that the gamma rays γ₃ are not incident on thecapacitor dielectric film 21 a right under the upper electrode 22 a,formula (8) is satisfied.

Next, the case of gamma rays γ₄ will be discussed.

The gamma rays γ₄ pass through an edge of, among the plurality ofblocking bodies 85, the blocking body 85 the farthest to theferroelectric capacitor Q and are incident on the capacitor dielectricfilm 21 a at an incident angle of θ₃.

Regarding the incident angle θ₃, the following formula (9) isgeometrically satisfied.

tan θ₃=(L1+L3−L2+(a−d)/2)/(h+hw)  (9)

In order to satisfy X=0, the following formula (10) is satisfied becauseof the same reason as the reason regarding formula (2).

(a−d)/2=(b−e)×tan θ₃  (10)

By substituting formula (9) for formula (10), the following formula isobtained.

(a−d)/2=(b−e)×(L1+L3−L2+(a−d)/2)/(h+hw)  (11)

That is, in order that the gamma rays γ₄ are not incident on thecapacitor dielectric film 21 a right under the upper electrode 22 a,formula (11) is satisfied.

In formulae (2), (7), and (10), angles θ₁ to θ₃ are each an incidentangle of gamma rays that may be incident on the capacitor dielectricfilm 21 a without being blocked by tungsten in the first conductor plug33 and the blocking body 85.

According to formulae (2), (7), and (10), when the tangent of themaximum incident angle among such incident angles of gamma rays is equalto (a−d)/(2(b−e)), the width X of a portion of the capacitor dielectricfilm 21 a right under the upper electrode 22 a, the portion beingirradiated with the gamma rays, may be made zero.

Second Embodiment

In the first embodiment, the effect of blocking radiation such as gammarays by the first conductor plug 33 has been described. The firstconductor plug 33 larger than the upper electrode 22 a has not only sucha function of blocking radiation but also a function of making a stressapplied to the capacitor dielectric film 21 a uniform. The latter effectwill be described in a second embodiment.

FIG. 26 is an enlarged cross-sectional view of a ferroelectric capacitorQ in which, unlike the first embodiment, a first conductor plug 33 isformed so as to be smaller than an upper electrode 22 a and theperiphery of the ferroelectric capacitor Q according to a comparativeexample.

In FIG. 26, the same components as those described in the firstembodiment are assigned the same reference numerals as those in thefirst embodiment, and a description of the components is omitted below.This also applies to FIGS. 27 to 31 described below.

A tungsten film 32 b has a tensile stress, and thus the tungsten film 32b itself tends to shrink as illustrated by arrows A of FIG. 26. When thetungsten film 32 b shrinks in this manner, a stress B that pulls acapacitor dielectric film 21 a upward is generated.

The stress B strongly acts on a portion of the capacitor dielectric film21 a, the portion being located right under the first conductor plug 33,and negligibly acts on the other portion of the capacitor dielectricfilm 21 a. Thus, the stress acting on the capacitor dielectric film 21 abecomes nonuniform in the plane.

As a result, the amount of charge induced in the capacitor dielectricfilm 21 a by the piezoelectric effect due to the stress B also variesdepending on the position of the capacitor dielectric film 21 a, and itbecomes difficult to distinguish between data “0” and “1” stored in theferroelectric capacitor Q. It is believed that this problem becomessignificant particularly when the shift between the position of thefirst conductor plug 33 and the position of the ferroelectric capacitorQ is increased by a reduction in size of the ferroelectric capacitor Q.

FIG. 27 is an enlarged cross-sectional view of a ferroelectric capacitorQ of a semiconductor device and the periphery of the ferroelectriccapacitor Q according to the second embodiment. Each of the arrows A andB in FIG. 27 denotes the same meaning as that of arrows A and B in FIG.26.

As illustrated in FIG. 27, in the second embodiment, a first conductorplug 33 is larger than an upper electrode 22 a. Accordingly, the firstconductor plug 33 is in contact with the entire surface of the upperelectrode 22 a, and a stress B acting from a tungsten film 32 b to acapacitor dielectric film 21 a is easily uniformly applied over theentire surface of the capacitor dielectric film 21 a.

With this structure, since the amount of charge induced by thepiezoelectric effect becomes uniform in the capacitor dielectric film 21a, data of “0” and “1” stored in the ferroelectric capacitor Q may beeasily distinguished from each other in the second embodiment.

One of factors that control the uniformity of the amount of chargeinduced in the capacitor dielectric film 21 a is the position of thefirst conductor plug 33.

A description will be made of the position of the first conductor plug33 suitable for making the charge of the capacitor dielectric film 21 auniform.

FIGS. 28A and 28B are cross-sectional views for explaining a suitableposition of a first conductor plug 33.

In each of FIGS. 28A and 28B, the first conductor plug 33 is in contactwith the entire surface of an upper electrode 22 a, and thus thesemiconductor device has a structure suitable for blocking gamma rays bythe first conductor plug 33.

However, in the example illustrated in FIG. 28A, a center g₁ of gravityof a first hole 29 a and a center g₂ of gravity of the upper electrode22 a do not coincide with each other. With this deviation of the centerof gravity, the first conductor plug 33 unevenly protrudes either on theleft side or on the right side of the upper electrode 22 a.Consequently, a stress C applied from a tungsten film 32 b to acapacitor dielectric film 21 a becomes asymmetric between the left sideand the right side.

As a result, the amount of charge induced by the piezoelectric effectdue to the stress C varies in the plane of the capacitor dielectric film21 a, and it becomes difficult to distinguish data of “0” and “1” storedin a ferroelectric capacitor Q from each other.

In contrast, in the example illustrated in FIG. 28B, a center g₁ ofgravity of a first hole 29 a and a center g₂ of gravity of the upperelectrode 22 a coincide with each other. With this structure, theasymmetry of the stress C is removed. Accordingly, the amount of chargeinduced in a capacitor dielectric film 21 a becomes uniform in the planeof the capacitor dielectric film 21 a, and data “0” and “1” stored in aferroelectric capacitor Q may be easily distinguished from each other.

From the standpoint of improving the distinguishability of data in theferroelectric capacitor Q, it is preferable to make the center g₁ ofgravity of the first hole 29 a and the center g₂ of gravity of the upperelectrode 22 a coincide with each other.

Next, a description will be made of examples of a planar layout of anupper electrode 22 a and a first hole 29 a whose centers g₁ and g₂ ofgravity coincide with each other.

FIGS. 29A to 29D are plan views of a planar layout of an upper electrode22 a and a first hole 29 a whose centers g₁ and g₂ of gravity coincidewith each other.

In each of the examples illustrated in FIGS. 29A to 29D, one of theupper electrode 22 a and the first hole 29 a has a circular shape andthe other has a polygonal shape, and the upper electrode 22 a and thefirst hole 29 a are not similar to each other.

In contrast, FIGS. 30A and 30B are plan views in the case where thecenter g₁ of gravity of a first hole 29 a and the center g₂ of gravityof an upper electrode 22 a coincide with each other and the planar shapeof the upper electrode 22 a and the planar shape of the first hole 29 aare similar to each other.

In the example illustrated in FIG. 30A, the upper electrode 22 a and thefirst hole 29 a each have a rectangular shape.

In the example illustrated in FIG. 30B, the upper electrode 22 a and thefirst hole 29 a each have a circular shape.

When the planar shape of the upper electrode 22 a and the planar shapeof the first hole 29 a are similar to each other as illustrated in FIGS.30A and 30B, a stress C generated by the first conductor plug 33 (referto FIG. 14) in the first hole 29 a becomes uniform on the edge of theupper electrode 22 a. Accordingly, the amount of charge induced by thepiezoelectric effect due to the stress C may be made more uniform in theplane of the capacitor dielectric film 21 a.

FIGS. 31A and 31B are cross-sectional views illustrating other examplesof the first conductor plug 33.

In these examples, a part of a tungsten film 32 b of a first conductorplug 33 is led on a second interlayer insulating film 31, and a firstmetal wiring 36 a is formed by the tungsten film 32 b.

However, in the example illustrated in FIG. 31A, the tungsten film 32 bis embedded in a fifth hole 29 e, and thus a center g₃ of gravity of thetungsten film 32 b does not coincide with a center g₁ of gravity of afirst hole 29 a. Consequently, as in the case illustrated in FIG. 28A,the stress C that acts from the tungsten film 32 b to a capacitordielectric film 21 a becomes asymmetric.

In contrast, in the example illustrated in FIG. 31B, a center g₃ ofgravity of the tungsten film 32 b coincides with a center g₁ of gravityof a first hole 29 a. Consequently, as in the case illustrated in FIG.28B, the asymmetry of the stress C is removed, and the amount of chargeinduced in a capacitor dielectric film 21 a may be made uniform in theplane of the capacitor dielectric film 21 a.

Third Embodiment

In the first embodiment, a planar FeRAM is produced as a semiconductordevice. In a third embodiment, a stacked FeRAM, which is advantageous inminiaturization as compared with the planar FeRAM, is produced as asemiconductor device.

FIGS. 32A to 54 are cross-sectional views each illustrating a process ofproducing a semiconductor device according to the third embodiment. InFIGS. 32A to 54, the same components as those described in the firstembodiment are assigned the same reference numerals as those in thefirst embodiment, and a description of the components is omitted.

In order to produce this semiconductor device, first, the processillustrated in FIGS. 2A to 3A of the first embodiment is performed.Thus, a structure including first to third contact plugs 14 a to 14 cand lower rings 16 is formed as illustrated in FIG. 32A.

However, in this process, the conductor 15 (refer to FIG. 3A) of thefirst embodiment is not formed.

Next, as illustrated in FIG. 32B, a first antioxidation insulating film17 having a thickness of about 100 nm and a first interlayer insulatingfilm 18 having a thickness of about 200 nm are formed in that order, andthe first antioxidation insulating film 17 and the first interlayerinsulating film 18 are then patterned to form openings 18 a.

A width W2 of each of the openings 18 a is larger than a width of eachof the first to third contact plugs 14 a to 14 c, and is, for example,about 1.0 μm.

An etching gas used in this patterning is also not particularly limited.In the third embodiment, a mixed gas of CF₄ gas and C₄F₈ gas is used asthe etching gas.

Next, a process of forming the cross-sectional structure illustrated inFIG. 33 will be described.

First, a titanium film having a thickness of 30 nm and a titaniumnitride film having a thickness of 20 nm are formed in that order as anadhesion film 40 a on the inner surfaces of the openings 18 a and on thefirst interlayer insulating film 18 by a sputtering method.

Next, a tungsten film 40 b is formed on the adhesion film 40 a by a CVDmethod using hydrogen gas and tungsten hexafluoride gas as a depositiongas. Each of the openings 18 a is completely filled with the tungstenfilm 40 b. The thickness of the tungsten film 40 b in this state is, forexample, about 300 nm on the first interlayer insulating film 18.

Subsequently, unwanted portions of the adhesion film 40 a and thetungsten film 40 b on the first interlayer insulating film 18 areremoved by CMP. The adhesion film 40 a and the tungsten film 40 b areleft as a conductor 41 in only each of the openings 18 a.

In the CMP, over-polishing is performed so that polishing residue is notgenerated on the first interlayer insulating film 18. Therefore, theconductor 41 is formed in the opening 18 a up to a halfway position inthe depth direction of the opening 18 a, and thus an upper portion ofthe opening 18 a is not filled with the conductor 41.

The conductor 41 is electrically connected to the first contact plug 14a or a second contact plug 14 c provided under the conductor 41.

Subsequently, as illustrated in FIG. 34, the upper surface of the firstinterlayer insulating film 18 is exposed to NH₃ plasma 202 so that NHgroups are bonded to the surface of the first interlayer insulating film18.

The conditions for generating the NH₃ plasma are not particularlylimited. In the third embodiment, in a parallel plate plasma processingchamber, a high-frequency power with a power of 55 W at a frequency of350 kHz is applied to a counter electrode facing a silicon substrate 1and a high-frequency power with a power of 100 W at a frequency of 13.56MHz is applied to the silicon substrate 1. For example, the pressure inthe chamber is 266 Pa, the substrate temperature is 400° C., and theflow rate of NH₃ gas is 350 sccm.

In order to facilitate bonding of NH groups, prior to the exposure toNH₃ plasma, the upper surface of the first interlayer insulating film 18may be cleaned by being exposed to Ar plasma.

Next, as illustrated in FIG. 35, a titanium film is formed as anunderlying conductive film 50 on the conductor 41 and the firstinterlayer insulating film 18 so as to have a thickness of about 20 nmby a sputtering method. Thus, the openings 18 a are completely filledwith the underlying conductive film 50.

In the process illustrated in FIG. 34, NH groups are bonded to thesurface of the first interlayer insulating film 18 in advance.Consequently, titanium, which is the material of the underlyingconductive film 50 may freely move on the first interlayer insulatingfilm 18, and the high-quality underlying conductive film 50 oriented inthe (002) direction may be formed.

Subsequently, as illustrated in FIG. 36, the upper surface of theunderlying conductive film 50 is polished by a CMP method to beplanarized.

Subsequently, the underlying conductive film 50 is subjected to RTA in anitrogen atmosphere at a substrate temperature of 650° C. for 60seconds. Consequently, titanium, which is the material of the underlyingconductive film 50, is nitrided to form titanium nitride oriented in the(111) direction. This RTA may be conducted in a nitrogen atmospherecontaining a rare gas.

Next, as illustrated in FIG. 37, the surface of the underlyingconductive film 50 is exposed to NH₃ plasma 203, thereby bonding NHgroups on the surface of the underlying conductive film 50. As for theconditions for generating the NH₃ plasma, for example, the sameconditions as those described with reference to FIG. 34 may be used.

Subsequently, as illustrated in FIG. 38, a titanium film is formed as ametal film 54 on the underlying conductive film 50 by a sputteringmethod so as to have a thickness of about 20 nm.

Since NH groups are bonded to the surface of the underlying conductivefilm 50 prior to this process, the titanium film becomes a high-qualityfilm that is self-oriented in the (002) direction.

Subsequently, the metal film 54 is subjected to RTA in a nitrogenatmosphere at a substrate temperature of 650° C. for 60 seconds.Consequently, titanium, which is the material of the metal film 54, isnitrided to obtain the metal film 54 composed of titanium nitrideoriented in the (111) direction.

This RTA may be conducted in a nitrogen atmosphere containing a raregas.

Next, as illustrated in FIG. 39, a titanium aluminum nitride (TiAlN)film is formed as a conductive oxygen barrier film 58 on the metal film54 by a reactive sputtering method so as to have a thickness of about100 nm.

The tungsten film 40 b of the conductor 41 is easily oxidized when thetungsten film 40 b contacts an oxygen-containing atmosphere. However,since the conductive oxygen barrier film 58 protects the conductor 41from oxygen in the outside atmosphere, the occurrence of contact failuredue to oxidation of the conductor 41 may be suppressed.

Furthermore, since the metal film 54 under the conductive oxygen barrierfilm 58 is composed of titanium nitride oriented in the (111) direction,the conductive oxygen barrier film 58 exhibits a good crystal qualitythat conforms to the orientation.

Next, a process of forming the cross-sectional structure illustrated inFIG. 40 will be described.

First, an iridium film having a thickness of about 60 to 100 nm isformed on the conductive oxygen barrier film 58 by a sputtering method.The iridium film functions as a first conductive film 61. Instead of theiridium film, a SrRuO₃ film may be formed as the first conductive film61.

Next, a first PZT film 62 x is formed on the first conductive film 61 byan MOCVD method so as to have a thickness of 100 nm. A second PZT film62 y is then formed on the first PZT film 62 x by a sputtering method soas to have a thickness of 10 nm. The first and second PZT films 62 x and62 y having a multilayer structure function as a ferroelectric film 62.

In the MOCVD method in forming the first PZT film 62 x, leadbis(dimethylheptanedionate) (Pb(DMHD)₂) is used as a liquid material oflead, and zirconium tetrakis(dimethylheptanedionate) (Zr(DMHD)₄) is usedas a liquid material of zirconium. Titanium bis(isopropoxy)bis(dipivaloylmethanate) (Ti(O-iPr)₂(DPM)₂) may be used as a liquidmaterial of titanium.

A first iridium oxide film 63 x is formed on the ferroelectric film 62by a sputtering method so as to have a thickness of about 25 nm, andannealing is then conducted in an oxygen-containing atmosphere so as tosufficiently crystallize the ferroelectric film 62 and to compensate foroxygen deficiency in the ferroelectric film 62. This annealing isconducted at a substrate temperature of 725° C. for 60 seconds whilesupplying argon gas and oxygen gas at flow rates of 2,000 sccm and 20sccm, respectively, to the annealing atmosphere.

Furthermore, a second iridium oxide film 63 y having a thickness ofabout 50 to 150 nm is formed on the first iridium oxide film 63 x by asputtering method.

Instead of the first iridium oxide film 63 x and the second iridiumoxide film 63 y, a single-layer film composed of any one of iridium,ruthenium, rhodium, rhenium, osmium, and palladium or an oxide filmthereof may be formed.

Furthermore, an iridium film 63 z having a thickness of about 50 nm to150 nm is formed on the second iridium oxide film 63 y by a sputteringmethod. The first iridium oxide film 63 x, the second iridium oxide film63 y, and the iridium film 63 z function as a second conductive film 63.

Subsequently, PZT deposited on the reverse face of the silicon substrate1 is removed by washing.

Subsequently, as illustrated in FIG. 41, a titanium nitride film isformed as a first mask material film 71 on the second conductive film 63by a sputtering method so as to have a thickness of about 200 nm. Atitanium aluminum nitride film may be formed instead of the titaniumnitride film.

A silicon oxide film is then formed on the first mask material film 71by a plasma CVD method using TEOS gas so as to have a thickness of about700 nm. This silicon oxide film functions as a second mask material film72.

Subsequently, as illustrated in FIG. 42, the second mask material film72 is patterned to form an island-shaped upper hard mask 72 a. The firstmask material film 71 is then etched using the upper hard mask 72 a as amask to form a lower hard mask 71 a.

Subsequently, as illustrated in FIG. 43, the first conductive film 61,the ferroelectric film 62, and the second conductive film 63 aredry-etched using the lower hard mask 71 a and the upper hard mask 72 aas a mask.

Consequently, a basic structure of ferroelectric capacitors Q eachformed by sequentially stacking a lower electrode 61 a, a capacitordielectric film 62 a, and an upper electrode 63 a is obtained.

An etching gas used in the dry etching is not particularly limited. Inthe third embodiment, a mixed gas of HBr gas, O₂ gas, C₄F₈ gas, and Argas is used as the etching gas.

The conductive oxygen barrier film 58 has etching resistance to theetching gas. Accordingly, this etching is automatically stopped on theconductive oxygen barrier film 58, and the entire surface of the siliconsubstrate 1 is covered with the conductive oxygen barrier film 58 evenafter the etching.

Although the thickness of the upper hard mask 72 a is somewhat reducedby this etching, the lower hard mask 71 a provided under the upper hardmask 72 a is not etched and the shape of the lower hard mask 71 a ismaintained. Accordingly, the side faces of the ferroelectric capacitorsQ may be precisely finished so as to have designed dimensions.

The tungsten film 40 b of the conductor 41 has a function of suppressingthe incidence of gamma rays from below the substrate on theferroelectric capacitors Q that are formed as described above.Therefore, in the patterning in this process, it is preferable that thegamma rays coming from below the substrate be effectively blocked by thetungsten film 40 b by making a width W4 of the lower electrode 61 asmaller than a width W3 of the tungsten film 40 b of the conductor 41.

Subsequently, as illustrated in FIG. 44, the upper hard mask 72 a isremoved by dry etching or wet etching.

Next, as illustrated in FIG. 45, portions of the underlying conductivefilm 50, the metal film 54, and the conductive oxygen barrier film 58,the portions not being covered with the ferroelectric capacitors Q, areremoved by dry etching to electrically separate the plurality offerroelectric capacitors Q to each other.

The lower hard mask 71 a is also removed by this dry etching, and theupper surface of the upper electrode 63 a is exposed.

The lower electrode 61 a is electrically connected to the conductor 41through the underlying conductive film 50, the metal film 54, and theconductive oxygen barrier film 58, all of which are left under the lowerelectrode 61 a.

In the third embodiment, as illustrated in FIG. 43, the width W4 of thelower electrode 61 a is smaller than the width W3 of the tungsten film40 b. In a reflection of this difference in the width, a difference inlevel is formed in the underlying conductive film 50, as illustrated inthe dotted line circle in FIG. 45.

As a result, the surface of the underlying conductive film 50 has astructure in which a first upper surface 50 a right under theferroelectric capacitor Q and a second upper surface 50 c extending in ahorizontal direction of the substrate are connected to each otherthrough a side face 50 b. Since the dry etching in this process proceedsin a direction perpendicular to the surface of the substrate, the sideface 50 b of the underlying conductive film 50 is flush with a side face61 x of the lower electrode 61 a, the side face 61 x being located abovethe side face 50 b.

Even after the above dry etching, the underlying conductive film 50 isleft over the entire upper surface of the conductor 41. Accordingly,oxidation of tungsten of the conductor 41 due to contact with oxygen maybe suppressed by the presence of the underlying conductive film 50.

A stress of the first interlayer insulating film 18 is weaker than astrong tensile stress of the tungsten of the conductor 41. Therefore, ifthe ferroelectric capacitor Q is formed over the conductor 41 and thefirst interlayer insulating film 18, a stress applied to the capacitordielectric film 62 a becomes nonuniform. In the third embodiment, sincethe ferroelectric capacitor Q is formed only on the conductor 41, such aproblem of nonuniformity of the stress may be solved, the amount ofcharge induced by the stress may be made uniform in the plane of thecapacitor dielectric film 62 a, and distinguishability of data in theferroelectric capacitor Q may be improved.

FIG. 55 is an enlarged plan view of the cell region I after theabove-described process is performed. FIG. 45 corresponds to across-sectional view taken along line XLV-XLV in FIG. 55.

As illustrated in FIG. 55, the conductor 41 and the opening 18 a thatdefines the outline of the conductor 41 are formed so as to have a sizethat includes the entire region of the lower electrode 61 a insidethereof in plan view.

Next, as illustrated in FIG. 46, an alumina film is formed as a firstprotective insulating film 74 on the upper surface of the firstinterlayer insulating film 18 and the surfaces of the ferroelectriccapacitors Q by a sputtering method. The first protective insulatingfilm 74 protects the capacitor dielectric film 62 a from a reducingsubstance such as hydrogen.

Subsequently, as illustrated in FIG. 47, the capacitor dielectric film62 a is subjected to recovery annealing at a substrate temperature of550° C. to 700° C. in an oxygen-containing atmosphere so that thecapacitor dielectric film 62 a recovers from damage sustained in theabove process. Oxygen 204 diffuses in the capacitor dielectric film 62 aduring this recovery annealing.

Subsequently, as illustrated in FIG. 48, an alumina film having athickness of about 38 nm is formed as a second protective insulatingfilm 76 on the first protective insulating film 74 by an MOCVD method.The second protective insulating film 76 reinforces a barrier capabilityfor hydrogen, which tends to be insufficient in the case where only thefirst protective insulating film 74 is provided, and thus may reliablyprotect the capacitor dielectric film 62 a from hydrogen.

Next, a process of forming the cross-sectional structure illustrated inFIG. 49 will be described.

First, a silicon oxide film is formed as a second insulating film 77 onthe second protective insulating film 76 by a plasma CVD method so as tohave a thickness of about 1,500 nm. For example, a mixed gas of TEOSgas, oxygen gas, and helium gas may be used as a deposition gas in theplasma CVD method.

The surface of the second insulating film 77 is planarized by a CMPmethod, and the second insulating film 77 is then annealed in a plasmaatmosphere of nitrous oxide (N₂O) gas or nitrogen gas. Thus, the secondinsulating film 77 is dehydrated, and the surface of the secondinsulating film 77 is nitrided to suppress readsorption of moisture.

Next, an alumina film is formed on the second insulating film 77 by asputtering method so as to have a thickness of about 20 to 100 nm. Thisalumina film functions as a third protective insulating film 78.Similarly to the first protective insulating film 74 and the secondprotective insulating film 76, the third protective insulating film 78has a function of protecting the capacitor dielectric film 62 a from areducing substance such as hydrogen.

The third protective insulating film 78 may be formed by a CVD methodinstead of the sputtering method.

A silicon oxide film is formed as a second interlayer insulating film 79on the third protective insulating film 78 by a plasma CVD method usingTEOS gas so as to have a thickness of about 250 nm.

Subsequently, as illustrated in FIG. 50, films ranging from the secondinterlayer insulating film 79 to the first protective insulating film 74are patterned by photolithography and dry etching to form first holes 77a on the ferroelectric capacitors Q.

An etching gas used in this dry etching is not particularly limited. Forexample, a mixed gas of C₄F₈, Ar, O₂, and CO may be used as the etchinggas.

Next, as illustrated in FIG. 51, annealing is performed on the secondinsulating film 77 in an oxygen-containing atmosphere at a substratetemperature of 500° C. for 60 minutes so that moisture contained in thesecond insulating film 77 is released to the outside through the firstholes 77 a. During this annealing, oxygen 205 diffuses into theferroelectric capacitors Q through the first holes 77 a.

In the third embodiment, since each of the first holes 77 a is formed soas to be larger than the corresponding upper electrode 63 a as in thefirst embodiment, moisture in the second insulating film 77 isimmediately released to the outside through the first holes 77 a andthus the effect of dehydration by annealing may be increased.

Subsequently, as illustrated in FIG. 52, a multilayer insulating filmranging from the second interlayer insulating film 79 to the firstantioxidation insulating film 17 is patterned by photolithography anddry etching.

By this patterning, in the cell region I, a second hole 77 b is formedon the second contact plug 14 b. In each of the cell peripheral portionII and the chip peripheral portion III, a third hole 77 c is formed onthe lower ring 16.

An etching gas used in the above dry etching is not particularlylimited. In the third embodiment, a mixed gas of C₄F₈, Ar, O₂, and CO isused as the etching gas of the first interlayer insulating film 18, thefirst protective insulating film 74, the second protective insulatingfilm 76, the second insulating film 77, the third protective insulatingfilm 78, and the second interlayer insulating film 79. The firstantioxidation insulating film 17 is removed by sputter etching usingargon gas.

Next, a process of forming the cross-sectional structure illustrated inFIG. 53 will be described.

First, a single-layer titanium nitride film is formed as a conductiveadhesion film 91 a on the inner surfaces of the first to third holes 77a to 77 c and the upper surface of the second interlayer insulating film79 by a sputtering method so as to have a thickness of about 50 to 100nm.

Next, a tungsten film 91 b is formed on the adhesion film 91 a by a CVDmethod using hydrogen gas and tungsten hexafluoride gas as a depositiongas. Each of the first to third holes 77 a to 77 c is filled with thetungsten film 91 b.

In this case, since the first hole 77 a is formed so as to be largerthan the upper electrode 63 a, a growth line 91 x of the adhesion film91 a is located on a side of the upper electrode 63 a, as illustrated inthe dotted line circle.

Accordingly, as in the first embodiment, it is possible to reduce therisk that hydrogen gas used in the deposition of the tungsten film 91 bpasses through the growth line 91 x and reaches the upper electrode 63 aand to suppress a decrease in the volume of the upper electrode 63 a,the decrease being due to reduction of iridium oxide of the upperelectrode 63 a by hydrogen.

The substrate temperature during the formation of the tungsten film 91 bis determined in accordance with the magnitude of a stress desired forthe tungsten film 91 b. The substrate temperature is preferably, forexample, about 350° C. to 400° C.

Subsequently, unwanted portions of the adhesion film 91 a and thetungsten film 91 b on the second interlayer insulating film 79 areremoved by a CMP method so that the adhesion film 91 a and the tungstenfilm 91 b are left only in the first to third holes 77 a to 77 c.

The adhesion film 91 a and the tungsten film 91 b that are left in thefirst holes 77 a function as a first conductor plug 92. The adhesionfilm 91 a and the tungsten film 91 b that are left in the second hole 77b functions as a second conductor plug 93.

The adhesion film 91 a and the tungsten film 91 b that are left in thethird holes 77 c in the cell peripheral portion II and the chipperipheral portion III function as upper rings 94.

The upper ring 94 and the lower ring 16 that are formed in the cellperipheral portion II form a conductor ring 37.

The upper ring 94 and the lower ring 16 that are formed in the chipperipheral portion III form a moisture-resistant ring 38.

FIG. 56 is an enlarged plan view of the cell region I after the processof forming the cross-sectional structure illustrated in FIG. 53 iscompleted. FIG. 53 corresponds to a cross-sectional view taken alongline LIII-LIII in FIG. 56.

As illustrated in FIG. 56, a plurality of first conductor plugs 92 areformed so as to correspond to the upper electrodes 63 a. Each of thefirst conductor plugs 92 and the corresponding first hole 77 a thatdefines the outline of the first conductor plug 92 are formed so as tohave a size that includes the entire region of the upper electrode 63 ainside thereof in plan view.

Next, as illustrated in FIG. 54, after a multilayer metal film is formedover the upper surface of the silicon substrate 1, then the multilayermetal film is patterned to form a first metal wiring 95 a, a firstconductive pad 95 b, and a second conductive pad 95 c.

For example, the multilayer metal film is formed by depositing atitanium film having a thickness of 60 nm, a titanium nitride filmhaving a thickness of 30 nm, a copper-containing aluminum film having athickness of 360 nm, a titanium film having a thickness of 5 nm, and atitanium nitride film having a thickness of 70 nm in that order by asputtering method.

Through the above process, a basic structure of the semiconductor deviceaccording to the third embodiment is formed.

According to the semiconductor device of the third embodiment, asillustrated in FIG. 56, the first conductor plug 92 is formed so as tocover the entire region of the upper electrode 63 a in plan view.Accordingly, most of the radiation such as gamma rays γ coming fromabove the silicon substrate 1 toward the capacitor dielectric film 62 amay be blocked by the tungsten film 91 b of the first conductor plug 92.Thus, the radiation resistance of the semiconductor device may beimproved.

In addition, since the conductor 41 is larger than the lower electrode61 a in plan view, most of the gamma rays γ coming from below thesilicon substrate 1 toward the capacitor dielectric film 62 a may beblocked by the tungsten film 40 b of the conductor 41. Thus, theradiation resistance of the semiconductor device may be furtherimproved.

The gamma rays γ coming from a lateral direction of the substrate towardthe ferroelectric capacitor Q may be blocked by the tungsten film 91 bof the conductor ring 37.

Fourth Embodiment

In the third embodiment, the first metal wiring 95 a is formed using themultilayer metal film including an aluminum film.

In contrast, in a fourth embodiment, wiring is formed using a damasceneprocess, which is useful for forming copper wiring.

FIGS. 57 to 65 are cross-sectional views each illustrating a process ofproducing a semiconductor device according to the fourth embodiment. InFIGS. 57 to 65, the same components as those described in the thirdembodiment are assigned the same reference numerals as those in thethird embodiment, and a description of the components is omitted.

First, a process of forming the cross-sectional structure illustrated inFIG. 57 will be described.

First, in accordance with the process illustrated in FIGS. 32A to 52 ofthe third embodiment, the structure in which the first to third holes 77a to 77 c are formed in the second interlayer insulating film 79 isformed.

Next, as in the third embodiment, an adhesion film 91 a and a tungstenfilm 91 b are formed on the upper surface of the second interlayerinsulating film 79 and on the inner surfaces of the first to third holes77 a to 77 c in that order.

However, in the fourth embodiment, the first hole 77 a is not completelyfilled with the tungsten film 91 b. A recess 91 x that reflects theshape of the first hole 77 a is formed in the upper surface of thetungsten film 91 b.

On the other hand, the second hole 77 b and the third holes 77 c arecompletely filled with the tungsten film 91 b.

In order to form the structure in which the second hole 77 b and thethird holes 77 c are completely filled with the tungsten film 91 b andthe first hole 77 a is not completely filled with the tungsten film 91b, the tungsten film 91 b is formed so as to have a thickness of about250 to 350 nm.

Next, as illustrated in FIG. 58, unwanted portions of the adhesion film91 a and the tungsten film 91 b on the second interlayer insulating film79 are removed by CMP.

Accordingly, as in the third embodiment, a first conductor plug 92 and asecond conductor plug 93 are respectively formed in the first hole 77 aand the second hole 77 b.

In the upper surface of the first conductor plug 92, a recess 92 x isformed as described above.

An upper ring 94 serving as a part of a conductor ring 37 is formed inthe third hole 77 c of the cell peripheral portion II. An upper ring 94serving as a part of a moisture-resistant ring 38 is formed in the thirdhole 77 c of the chip peripheral portion III.

Subsequently, as illustrated in FIG. 59, a silicon oxide film is formedas a third insulating film 100 on the second interlayer insulating film79, the first conductor plug 92, the second conductor plug 93, and theupper rings 94 by a plasma CVD method using TEOS gas so as to have athickness of about 300 nm.

Subsequently, as illustrated in FIG. 60, the third insulating film 100is patterned by photolithography and dry etching to form a first wiringgroove 100 a continuous to the recess 92 x.

An etching gas used in the dry etching is not particularly limited. Inthe fourth embodiment, a mixed gas of C₄F₈, Ar, O₂, and CO is used asthe etching gas.

The width of the first wiring groove 100 a is also not particularlylimited. However, it is preferable that a width D2 of the first wiringgroove 100 a be larger than a width D1 of the recess 92 x inconsideration of a positional shift between the first wiring groove 100a and the recess 92 x so that the whole recess 92 x is exposed from thefirst wiring groove 100 a even when such a positional shift occurs.

In the fourth embodiment, the width D1 of the recess 92 x is about 0.5to 0.8 μm, and the width D2 of the first wiring groove 100 a is about0.9 to 1.0 μm, which is larger than the width D1 of the recess 92 x.

In this process, a first hole 100 b and second holes 100 c are alsoformed in the third insulating film 100 on the second conductor plug 93and the upper rings 94, respectively.

Next, as illustrated in FIG. 61, a tantalum nitride film is formed as afirst barrier metal film 102 against copper on the upper surface of thethird insulating film 100 and the inner surfaces of the first wiringgroove 100 a, the first hole 100 b, and the second holes 100 c by asputtering method so as to have a thickness of about 50 nm.

Next, as illustrated in FIG. 62, a first copper film 104 is formed onthe first barrier metal film 102 by a plating method or a CVD method sothat each of the first wiring groove 100 a, the first hole 100 b, andthe second holes 100 c is completely filled with the first copper film104.

Subsequently, as illustrated in FIG. 63, unwanted portions of the firstbarrier metal film 102 and the first copper film 104 on the thirdinsulating film 100 are removed by CMP.

As a result, the first barrier metal film 102 and the first copper film104 are left as a first copper wiring 106 in the first wiring groove 100a.

In the first hole 100 b, the first barrier metal film 102 and the firstcopper film 104 are left as a first copper plug 107. In the second holes100 c, the barrier metal film 102 and the first copper film 104 are leftas copper rings 108.

Subsequently, as illustrated in FIG. 64, a silicon nitride film isformed as a third antioxidation insulating film 111 over the entireupper surface of the silicon substrate 1 by a CVD method so as to have athickness of about 50 nm.

Furthermore, a silicon oxide film is formed on the third antioxidationinsulating film 111 by a plasma CVD method using TEOS gas so as to havea thickness of about 500 nm. This silicon oxide film functions as afourth insulating film 112.

The deposition atmosphere of the fourth insulating film 112 containsoxygen. However, since the third antioxidation insulating film 111 isformed prior to the deposition of the fourth insulating film 112, it ispossible to suppress oxidation of the first copper wiring 106 and thefirst copper plug 107 by the oxygen.

Next, a process of forming the cross-sectional structure illustrated inFIG. 65 will be described.

First, the fourth insulating film 112 is patterned using the thirdantioxidation insulating film 111 as an etching stopper film. Thus, asecond wiring groove 112 a is formed on the first copper wiring 106.

Subsequently, the third antioxidation insulating film 111 located at thebottom of the second wiring groove 112 a is patterned to form a thirdhole 111 a. A second barrier metal film 113 a and a second copper film113 b are then sequentially formed inside each of the third hole 111 aand the second wiring groove 112 a.

The second barrier metal film 113 a is a tantalum nitride film formed bya sputtering method. The second copper film 113 b is formed by a platingmethod or a CVD method.

Subsequently, unwanted portions of the second barrier metal film 113 aand the second copper film 113 b on the upper surface of the fourthinsulating film 112 are removed by CMP. The second barrier metal film113 a and the second copper film 113 b are left as a second copperwiring 115 only in the second wiring groove 112 a.

Through the above process, a basic structure of the semiconductor deviceaccording to the fourth embodiment is formed.

According to the fourth embodiment, as illustrated in FIG. 65, the firstconductor plug 92 and the conductor 41 that are respectively providedabove and below the ferroelectric capacitor Q may protect theferroelectric capacitor Q from gamma rays. Thus, the radiationresistance of the semiconductor device may be improved.

Furthermore, since the electrical resistance of the first copper wiring106 is lower than aluminum, which is a main material of the metal wiring95 a (refer to FIG. 54) of the third embodiment, high-speed operationand low-power consumption of the semiconductor device may be realizedcompared with the third embodiment.

Since the recess 92 x is provided in the first conductor plug 92 and thefirst copper wiring 106 is embedded in the recess 92 x, the first copperwiring 106 has a thickness corresponds to the thickness of the thirdinsulating film 100 and the depth of the recess 92 x. Thus, thethickness of the first copper wiring 106 is increased by the lengthcorresponding to the depth of the recess 92 x. With this structure, theelectrical resistance of the first copper wiring 106 may be reduced ascompared with the case where the first copper wiring 106 is embeddedonly in the third insulating film 100 without providing the recess 92 x,and thus higher-speed operation and lower-power consumption of thesemiconductor device may be realized.

Furthermore, the first copper wiring 106 and the second copper wiring115 are formed above the ferroelectric capacitor Q after the formationof the ferroelectric capacitor Q. Therefore, the first copper wiring 106and the second copper wiring 115 are not exposed to crystallizationannealing and recovery annealing performed on the ferroelectriccapacitor Q. Thus, there is no risk that the first copper wiring 106 andthe second copper wiring 115 are melted by the annealing.

All examples and conditional language recited herein are intended forpedagogical purposes to aid the reader in understanding the inventionand the concepts contributed by the inventor to furthering the art, andare to be construed as being without limitation to such specificallyrecited examples and conditions, nor does the organization of suchexamples in the specification relate to a showing of the superiority andinferiority of the invention. Although the embodiments of the presentinvention have been described in detail, it should be understood thatthe various changes, substitutions, and alterations could be made heretowithout departing from the spirit and scope of the invention.

What is claimed is:
 1. A semiconductor device comprising: asemiconductor substrate; a first insulating film that is formed over thesemiconductor substrate; a capacitor that is formed over the firstinsulating film and is formed by sequentially stacking a lowerelectrode, a capacitor dielectric film, and an upper electrode; a secondinsulating film that is formed over the capacitor and has a holeincluding the entire region of the upper electrode in plan view; and aconductor plug that is formed in the hole and contains tungsten.
 2. Thesemiconductor device according to claim 1, wherein the center of gravityof the hole and the center of gravity of the upper electrode coincidewith each other in plan view.
 3. The semiconductor device according toclaim 1, wherein the shape of the hole is similar to the shape of theupper electrode in plan view.
 4. The semiconductor device according toclaim 1, wherein the hole is larger than a lower surface of the upperelectrode in plan view.
 5. The semiconductor device according to claim1, wherein the conductor plug includes a tungsten film having a recessin an upper surface of the tungsten film, and a copper wiring is formedin the recess.
 6. The semiconductor device according to claim 5, furthercomprising: a third insulating film that is formed over the secondinsulating film and has a wiring groove on the hole, the wiring groovebeing continuous to the recess, wherein the copper wiring is formed inthe recess and the wiring groove.
 7. The semiconductor device accordingto claim 6, wherein the wiring groove has a width larger than a width ofthe recess.
 8. The semiconductor device according to claim 1, furthercomprising: an opening that is formed in the first insulating film underthe capacitor and includes the entire region of the lower electrode inplan view, and a conductor that contains tungsten and is embedded in thefast opening.
 9. The semiconductor device according to claim 8, furthercomprising: an element isolation insulating film that is formed in thesemiconductor substrate, wherein the opening is formed on the elementisolation insulating film.
 10. The semiconductor device according toclaim 8, further comprising: an antioxidation insulating film that isformed over the conductor and the first insulating film and suppressesoxidation of the conductor, and, wherein the capacitor is formed on theantioxidation insulating film.
 11. The semiconductor device according toclaim 1, further comprising: an impurity diffusion region that is formedin the semiconductor substrate; a contact plug that is embedded in thefirst insulating film over the impurity diffusion region and iselectrically connected to the impurity diffusion region; an interlayerinsulating film that is formed over the first insulating film and has anopening on the contact plug, the opening including the entire region ofthe lower electrode in plan view; and a conductor that is embedded inthe opening, the conductor containing tungsten and being electricallyconnected to the contact plug and the lower electrode of the capacitorwhich is formed on the conductor.
 12. The semiconductor device accordingto claim 11, further comprising: a conductive film that is formed on theconductor so to fill the opening, wherein the conductor is formed up toa halfway position of the opening in a depth direction, and thecapacitor is formed on the conductive film.
 13. The semiconductor deviceaccording to claim 12, wherein the conductive film has a first uppersurface right under the capacitor, a side face that is connected to thefirst upper surface and is flush with a side face of the lowerelectrode, and a second upper surface connected to the side face andextending in a parallel to a surface of the substrate.
 14. Thesemiconductor device according to claim 1, wherein a plurality of thecapacitors and a plurality of the conductor plugs are provided, and aradioactive ray coming toward the capacitor dielectric film right underthe upper electrode of one of the capacitors is blocked by the conductorplug on the other capacitor.
 15. The semiconductor device according toclaim 14, wherein among radiation that is incident on the capacitordielectric film without being blocked by the conductor plug on the othercapacitor, the radiation having the maximum incident angle has a tangentof the incident angle, the tangent being equal to a value(a−d)/(2(b−e)), where a represents a distance between lower surfaces ofthe upper electrodes of adjacent capacitors, b represents a distancebetween the lower surface of the upper electrode and an upper surface ofthe conductor plug, d represents a distance between lower surfaces ofadjacent conductor plugs, and e represents a distance between the uppersurface and the lower surface of the conductor plug.
 16. Thesemiconductor device according to claim 15, wherein the tangent isrepresented by (c+d)/(2e) where c represents a distance between theupper surfaces of the adjacent conductor plugs.
 17. The semiconductordevice according to claim 1, wherein another conductor plug containingtungsten is provided in the second insulating film on a side of thecapacitor, and radiation coming toward the capacitor dielectric filmright under the upper electrode is blocked by the another conductorplug.
 18. The semiconductor device according to claim 1, furthercomprising: a blocking body formed above the second insulating film andcontaining tungsten, wherein radiation coming toward the capacitordielectric film right under the upper electrode is blocked by theblocking body.
 19. The semiconductor device according to claim 1,wherein the semiconductor substrate has a cell region where a pluralityof the capacitors are formed, and a conductor ring containing tungsten,the conductor ring having a height at least reaching the upper surfaceof the second insulating film and surrounding the cell region in planview, is provided on the semiconductor substrate.
 20. A method forproducing a semiconductor device comprising: forming a first insulatingfilm on a semiconductor substrate; forming, on the first insulatingfilm, a capacitor by sequentially stacking a lower electrode, acapacitor dielectric film, and an upper electrode; forming a secondinsulating film that covers the capacitor; forming a hole in the secondinsulating film by pattering the second insulating film, the holeincluding the entire region of the upper electrode in plan view; andforming, in the hole, a conductor plug that is electrically connected tothe upper electrode and that contains tungsten.